Asia Symposium on Quality Electronic Design (ASQED)

ASQED 2009 Program


A New World of Partnerships for 22nm and Below

The Present Status and Issues in Solar Photovoltaic Systems

IC Packaging Technology - Electronic's New Gatekeeper for Cost and Performance

Trust But Verify – Product Quality in the SoC Era

Variability-Resilient Mixed-Signal IC Design Methods

Panel Discussion & Dinner (sponsored by MIDA)

Global Trends of Electronic Industry and opportunities for Malaysia


Tera-scale Computing and Interconnect Challenges – 3D Stacking Considerations

Advanced Packaging Technologies and Future Interconnection Trends

Technical Sessions

Advanced Memory and Special Circuit Techniques

Multi-gate Devices and Manufacturing

Power Delivery, Packaging and PCB Technology

Low-power and Noise-aware Design Innovations

Noise, Reliability, and Variability

Nano and Bio Electronics Innovations

Photovoltaic Technology & Manufacturing

Analog and Low Power Test

Misc. Design Topics

CMOS Imagers and Data Converters

Physical and System Design

Advanced Topics in Design

Semiconductor Technology & Manufacturing

Test & Verification