Asia Symposium on Quality Electronic Design (ASQED)

ASQED 2015 Technical Program Committee

Yiran Chen, University of Pittsburgh (chair)

Chen-Yong Cher, IBM (co-Chair)

 

IoT, Smart Sensors Design and Technology (SSDT)

Hai Li, University of Pittsburgh (Chair)

Haibo Wang, Southern Illinois University (Co-Chair)

Committee Members:

 

System-level Design and Methodologies (SDM)

Michael Huebner, Ruhr-University (Chair)

Wei Zhang (Co-Chair)

Committee Members:

Abbes Amira - University of the West of Scotland, UK

Rajesh Berigei - Texas Instruments Inc.

Yu Cai - LSI Corporation

Deming Chen - University of Illinois, Urbana-Champaign

Eui-Young Chung - Yonsei University

Alberto Del Barrio Garcia - Complutense University of Madrid

Fabiano Hessel - PUCRS

Chih-Tsun Huang - National Tsing Hua University, Taiwan

Mohammad Khavari Tavana - George Mason University

Seung-Eun Lee - Seoul National University of Science and Technology

Duo Liu - Chongqing University

Farhad Mehdipour - E-JUST Center, Kyushu University

Qinru Qiu - Syracuse University

V. Ramgopal Rao - IIT Bombay

Shanq-Jang Ruan - National Taiwan University of Sci. and Tech.

Libor Rufer - University of Grenoble / TIMA Laboratory

Ashraf Salem - Mentor Graphics

Chung-An Shen - National Taiwan University of Science and Technology

Sharad Sinha - The Hong Kong University of Science and Technology

Jay Sivagnaname - Freescale Semiconductor

Haibo Wang - Southern Illinois University

Bin Wu - Qualcomm Inc.

Teong Guan Yew - Intel Corporation

 

Package and Three-Dimensional Integration (PTDI)

Farhang Yazdani, BroadPak Corporation, USA (Chair)

Wenyan Yin, Zhejiang University (Co-Chair)

Committee Members:

Ibrahim Ahmad - Universiti Tenaga Nasional

Yuuki Araga - National Institute of Advanced Industrial Science and Technology (AIST), Japan

Bok Eng Cheah - Intel Corporation

Guoqing Chen - AMD

Houle Gan - Intel

Minghui Han - Samsung

Nauman Khan - Intel Corporation

SoYoung Kim - SungKyunKwan University

Yong Liu - Fairchild Semiconductor

Pol Marchal - IMEC, Belgium

Vasilis Pavlidis - University of Manchester

Weiping Shi - Texas A&M University

Jianyong Xie - Intel Corporation

Cindy-Yang Yi - University of Kansas

Payman Zarkesh-Ha - University of New Mexico

 

Integrated Circuit Design (ICD)

Xiaoyang Zeng (Chair)

Chuan Zhang, Southeast University (Co-Chair)

Zushu Yan (Co-Chair)

Committee Members:

Ali Afzali-Kusha - University of Tehran

Jin-Ho Ahn - Hoseo University

George Alexiou - University of Patras

Chin Hai Ang - Altera Corporation Sdn Bhd

Sanghyun Baeg - Hanyang University

Sudarshan Bahukudumbi - Intel Corporation

Chip Hong CHANG - Nanyang Technological University

Subho Chattejee - Intel Custom Foundry.

Marshnil Dave - Marvell Semiconductors

Serge Demidenko - Massey University

Abhilash Goyal - Oracle

Stephen Heinrich-Barna - Texas Instruments, Inc

Qijun Huang - Wuhan University

Shyh-Jye Jou

Rouwaida Kanj - American University of Beirut

Tony T. Kim - Nanyang Technological University

Choon Hou Lock - Intel

Hidetoshi Matsuoka - Fujitsu Laboratories Ltd

Pascal Meinerzhagen - Intel Circuit Research Lab

Rajendra Patrikar - VNIT Nagpur

Radu Secareanu - Freescale

Maryam Shojaei Baghini - IIT-Bombay

Jawar Singh - Indian Institute of Information Technology, Design and Manufacturing, Jabalpur, India

Lei Wang - University of Connecticut

Yong Wang - Shangdong Univ

Yintang Yang - Xidian Univ

Jun Yin - University of Macau

Yongsheng Yin - Hefei University of Technology

Jingyi Zhang - Broadcom

Yaohua Zhao - Mediatek

Geng Zheng - Analog Devices Inc.

 

EDA,IP Cores; Interop, Security, and Reuse (EDA)

James Lei, Applied Harmonics Corp (Chair)

Andre Reis, UFRGS (Co-Chair)

Committee Members:

Swarup Bhunia - Case Western Reserve University

ASRAL BIN BAHARI JAMBEK

Swaroop Ghosh - University of South Florida

Chien-Nan Liu - National Central University

Alexander Mitev - Aries Design Automation

Guo Yu - Oracle Corporation

Min Zhao - Oracle Corportation

Cheng Zhuo - Intel

 

Design Verification and Design for Test (DVFT)

Miroslav Velev, Aries Design Automation (Chair)

Sungho Kang, Yonsei University (Co-Chair)

Committee Members:

Jin-Ho Ahn - Hoseo University

Mohana Asha Latha Dubasi - North Dakota State University

Masahiro Fujita - University of Tokyo

Patrick Girard - LIRMM

Yanxiang He - Wuhan Univ

Michael Hsiao - Virginia Tech

Jiun-Lang Huang - National Taiwan University

Moiz Khan - Synopsys Inc.

Jin-Fu Li - National Central University

Sungju Park - Hanyang University

Spyros Tragoudas - Southern Illinois University

Yiorgos Tsiatouhas - University of Ioannina

Raimund Ubar - Tallinn University of Technology

Vinod Viswanath - Real Intent

 

Physical Design, Methodologies & Tools (PDM)

Aida Todri-Sanial, LIRMM (Chair)

Bao Liu, University of Texas at San Antonio (Co-Chair)

Committee Members:

Ibrahim Ahmad - Universiti Tenaga Nasional

Boon-Chong Ang - eASIC

Senthil Arasu - Broadcom

Kevin Brelsford - Synopsys

Yuanqing Cheng

Shih-Hsu Huang - Chung Yuan Christian University

Yu-Min Lee - National Chiao Tung University

Barry Linder

Karthikeyan Lingasubramanian - University of Alabama at Birmingham

Yuchun Ma - Tsinghua University

Renato Ribas - UFRGS

Jia Wang - Illinois Institute of Technology

Hua Xiang - IBM

Hu Xu - NVIDIA Corporation

Fakhrul Zaman Rokhani

Xuan Zeng - Fudan Univ

 

Emerging Process & Device Technologies (EDT)

Jawar Singh, Indian Institute of Information Technology, Design and Manufacturing, Jabalpur, India (Chair)

Hua-Qiang Wu, Tsinghua University (Co-Chair)

Committee Members:

Paulo Butzen - Universidade Federal do Rio Grande - FURG

Eric Foreman - IBM

Amlan Ghosh - AMD

Lili He - San Jose State University

Vivek Joshi - GLOBALFOUNDRIES

Pankaj Kalra - SanDisk

Nikos Konofaos - Aristotle University of Thessaloniki

Hai Li - University of Pittsburgh

Yiming Li - National Chiao Tung University

Jimson Mathew - University of Bristol

Saraju Mohanty - University of North Texas

Arthur Nieuwoudt - Synopsys

Takashi Sato - Kyoto University

Yiyu Shi - Missouri University of Science and Technology

Tahui Wang - National Chiao Tung University, Taiwan

Xuefeng Zeng - Globalfoundries US Inc.

Ehrenfried Zschech - Fraunhofer IKTS Dresden

 

Design for Manufacturability/Yield & Quality (DFQ)

Xuan Zeng, Fudan Univ (Chair)

Yiyu Shi, Missouri University of Science and Technology (Co-Chair)

Committee Members:

Swarup Bhunia - Case Western Reserve University

Shir-Shen Chang - Synopsys

Chien-Nan Liu - National Central University

Yuchun Ma - Tsinghua University

Alexander Mitev - Aries Design Automation

Andre Reis - UFRGS

 

Antennas Technology, Design and Applications (ANT)

Bing-Zhong Wang, University of Electronic Science and Technology of China (Chair)

Rushan Chen, Nanjing University of Science and Technology (NUST) (Co-Chair)

Committee Members:

Lixin Guo - Xidian Univ

Srini Krishnamoorthy - Advanced Micro Devices

Haiwen Liu - NA

Guoqing Luo - Hangzhou Dianzi University

Yueping Zhang - Nanyang Technological Univ