ASQED 2013 Call for Papers
For any question regarding the paper and tutorial submissionplease contact the publication committee by sending email to info@asqed.com. Please note the following important dates:
| IMPORTANT DATES | |
| Extended Paper Submission Deadline Full Length paper |
May 17, 2013 |
| Acceptance Notification | June 14, 2013 |
| Camera-Ready Paper Due | July 19, 2013 |
| Conference | Aug. 26-28, 2013 |
ASQED strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design and intends to highlight and accelerate cooperation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities. ASQED’13 starts with Microelectronic Olympiad competition on Monday Aug. 26 and then spans two days, in four parallel tracks, hosting near 100 technical presentations, several keynote speakers, tutorials and other informal meetings. Conference Proceedings will be published by IEEE and posted in the IEEE digital library
Papers are requested in the following areas
As a premier Asia Symposium, ASQED accepts and promotes papers related to circuit and system design (digital, analog, RF, and mixed-signal), semiconductor manufacturing, advanced IC Packaging, Test, Electronic Design Automation (EDA), as well as emerging semiconductor nano/bio-technologies, and photovoltaic electronics. Topics of interest for paper submission are as follows:
IC and System-level Design & Test System-level Design, Methodologies & Tools
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• Analog, Digital, Mixed-Signal and RFIC Design
• FPGA Architecture, Design, and CAD
• Robust & Power-conscious Circuits & Systems
• Design of Reliable & Fault Tolerant Circuits and Systems
• Design of Embedded Systems
IP Design, Quality, Interoperability and Reuse
- • Design Verification and Design for Testability
• Physical Design, Methodologies & Tools
• EDA Methodologies, Tools, Flows
Semiconductor Process and Devices Emerging/Innovative
- • Process & Device Technologies
• Yield and Reliability Analysis, Prediction, and Management
Advanced IC Packaging, 3D ICs IC Package - Design Interactions & Co-Design
- • Advanced 3D ICs & 3D Packaging
• High density PCB/PWB
• Signal and Power Integrity
Sensors Technology, Design and Applications, MEMS/NEMS
Submission of Papers
Paper submission must be done on-line through the conference web site at https://www.softconf.com/d/asqed2013 . The guidelines for the final paper format are provided on the symposium website. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 10 pages) along with abstract of about 200 words. Please check the as-printed appearance of your paper before sending your paper. In case of any problems, email asqed2013@asqed.com.