ASQED 2010 Call for Papers is now closed. Please re-visit in September.
For any question please contact the publication committee by sending email to info@ASQED.com. Please note the following important dates:
| IMPORTANT DATES | |
| Extended Paper Submission Deadline Full Length paper |
April 23, 2010 (CLOSED) |
| Acceptance Notification | May 17, 2010 |
| Camera-Ready Paper Due | June 14, 2010 |
| Conference | Aug. 3-4, 2010 |
ASQED 2010 is the second event organized by the International Society for Quality Electronic Design in Asia. This event is being co-organized and managed by Malaysia Institute of Microsystems (MIMs) and Malaysian Industry Government Group for High Technology (MIGHT) with support from Malaysian Industrial Development Authority (MIDA). This symposium also gathers leading industrial and educational entity such as Intel Malaysia, Freescale Semiconductor, STATS ChipPAC Malaysia, Swinburne University of Technology and Monash University (Sunway Campus) as committee members. ASQED 2010 strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design and intends to highlight and accelerate cooperation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities. ASQED’10 spans two days, in four parallel tracks, hosting near 100 technical presentations, several keynote speakers, tutorials and other informal meetings. Conference Proceedings will be published by IEEE and posted in the IEEE digital library
Papers are requested in the following areas
As a premier Asia Symposium, ASQED 2010 accepts and promotes papers related to circuit and system design (digital, analog, RF, and mixed-signal), semiconductor manufacturing, advanced IC Packaging, Test, Electronic Design Automation (EDA), as well as emerging semiconductor nano/bio-technologies, and photovoltaic electronics. Topics of interest for paper submission are as follows:
- Circuit & System Design
- Test & Verification
- IC Packaging Technology
- PCB and PWB Technology & Manufacturing
- Semiconductor & Nano Technology
- Bio Electronics Innovations
- Photovoltaic Technology & Manufacturing
- Electronic Design Automation Methodologies
- Micro-Electro-Mechanical System (MEMS)
Submission of Papers
Paper submission must be done on-line through the conference web site at https://www.softconf.com/a/asqed2010. The guidelines for the final paper format are provided on the symposium website. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 10 pages) along with abstract of about 200 words. To permit a blind review, do not include name(s) or affliation(s) of the author(s) on the manuscript and abstract. The complete contact author information needs to be entered separately. Please check the as-printed appearance of your paper before sending your paper. In case of any problems, email info@ASQED.com. Please note the following important dates:
- Paper Submission Deadline April 23, 2010 (CLOSED)
- Acceptance Notification May 17, 2010
- Final Camera-Ready paper June 14, 2010
- PAPER SUBMISSION LINK