Asia Symposium on Quality Electronic Design (ASQED)
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ASQED 2015 Call for Papers

  • PDF Version of Call for Papers
  • Submit Your Paper

For any question regarding the paper and tutorial submissionplease contact the publication committee by sending email to info@asqed.com. Please note the following important dates:

IMPORTANT DATES
Paper Submission Deadline
Full Length paper
March 25, 2015
Acceptance Notification May 1, 2015
Camera-Ready Paper Due June. 1, 2015
Conference Aug. 3-5, 2015

 

ISQED strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design and intends to highlight and accelerate cooperation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities. ISQED-China’14 starts with Microelectronic Olympiad competition on Monday Oct. 27 and then spans two days, in four parallel tracks, hosting many technical presentations, several keynote speakers, tutorials and other informal meetings. All past conference proceedings have been published by IEEE and posted in the IEEE digital library and indexed by Scopus.

Papers are requested in the following areas

As a premier Asia Symposium, ISQED accepts and promotes papers related to circuit and system design (digital, analog, RF, and mixed-signal), semiconductor manufacturing, advanced IC Packaging, Test, Electronic Design Automation (EDA), as well as emerging semiconductor nano/bio-technologies, and photovoltaic electronics. Topics of interest for paper submission are as follows:

 

IC and System-level Design & Test System-level Design, Methodologies & Tools

    • Analog, Digital, Mixed-Signal and RFIC Design
    • FPGA Architecture, Design, and CAD
    • Robust & Power-conscious Circuits & Systems
    • Design of Reliable & Fault Tolerant Circuits and Systems
    • Design of Embedded Systems

IP Design, Quality, Interoperability and Reuse

    • Design Verification and Design for Testability
    • Physical Design, Methodologies & Tools
    • EDA Methodologies, Tools, Flows

Semiconductor Process and Devices Emerging/Innovative

    • Process & Device Technologies
    • Yield and Reliability Analysis, Prediction, and Management

Advanced IC Packaging, 3D ICs IC Package - Design Interactions & Co-Design

    • Advanced 3D ICs & 3D Packaging
    • High density PCB/PWB
    • Signal and Power Integrity

Sensors Technology, Design and Applications, MEMS/NEMS

 

Submission of Papers

Paper submission must be done on-line through the conference web site at TBD. The guidelines for the final paper format are provided on the symposium website. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 10 pages) along with abstract of about 200 words. Please check the as-printed appearance of your paper before sending your paper. In case of any problems, email asqed2015@asqed.com.

  • PAPER SUBMISSION LINK

Resources for Authors