Asia Symposium on Quality Electronic Design (ASQED)

Press Release

3rd Asia Symposium on Quality Electronic Design (ASQED) Announces Program;

Convenes July 19‐20, Kuala Lumpur, Malaysia

PDF IconPDF Version


SAN JOSE, CA and Kuala Lumpur, Malaysia – May 18, 2011 – The third Asia Symposium on Quality Electronic Design ( ASQED ) today announced its 2011 program consisting of several keynotes by industry leaders and university experts, tutorials and over 50 technical presentations


ASQED is being held on July 19-20, 2011 in Kuala Lumpur, Malaysia. ASQED plays a critical role in promoting quality-based electronic design and manufacturing in Asia and plans to be an integral part of establishing a communication link between semiconductor, nano-electronic, bio-electronic, MEMS (microelectromechanical) and NEMS (nanoelectromechanical) systems, and photovoltaic (PV) technologies and disciplines such as design, manufacturing, test and packaging.


Powerful Keynotes Headline Conference

ASQED keynote sessions are sponsored by Synopsys and include:


Nanotechnology and the Challenges Facing Designers of Circuits and Systems

Prof. Arokia Nathan

Chair of Nanotechnology, London Centre for Nanotechnology,

University College London, England


Electronics for Energy Management

Dr. Bernard Courtois

Director of CMP and TIMA, France


The Packaging Technology Domain

Prof. Younggap You

Dean of College of Electrical and Computer Engineering, Chungbuk National University, Korea


Challenges in Interconnection

Dr. ChoonHeung Lee

Head of Corp. Technology, Amkor, Korea


Advances in High Density Interconnections-Promoting Innovations and Lower Costs

Happy Holden

Chief Technical Officer, Foxconn Advanced Technology, Taiwan



ASQED is pleased to offer the following tutorials by industry experts:


A Tool Box for Successful 3D Integration

Mark Scannell

Program Director, 3D Integration

CEA – Léti, France


Modern 3D Packaging Technologies Driving the Need for IC, Package and Printed Circuit Board (PCB) Co-Design Methodologies

John Park

Methodology Architect

Mentor Graphics, USA


Memory Packaging Challenges and Approaches for the Evolving World of the Portable Client and Cloud

Richard Crisp

Principal Technologist

Tessera, USA


3D Silicon Interposer and Through Silicon Via (TSV): Application, Requirement, Infrastructure and Technologies

Farhang Yazdani

President and CTO

BroadPak Corporation, USA


Technical Sessions

The ASQED technical sessions consist of over 50 papers by engineers and researchers worldwide.




ASQED is the third event organized by the International Society for Quality Electronic Design ( in Asia. Conference proceedings are published by the IEEE.

Please visit for more information and to register.



Press Contact:

Georgia Marszalek, ValleyPR LLC for ASQED, +1-650-345-7477,


All trademarks and tradenames are the property of their respective owners.